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|  MIL-C-64025(AR)
3.11 High temperature operation. The Remote Control Unit shall
meet the performance characteristics specified in 3.6 at plus 145
(+5/-0)
degrees
F
when
tested
as
specified
in
4.5.4.
Before potting, all circuit card
3.12 Stress screening.
assemblies shall have temperature stress screening performed prior to
testing. Card assemblies are to be temperature cycled without power
applied. The temperature range is -50+10 degrees F to 150+10 degrees
F with a dwell time at temperature extremes of 15 +5 minutes. The rate
of temperature change is 18 degrees F/minute minimum with 10 cycles
minimum. Circuit card assemblies which have component failures at test
representing more than 25% of the total board components shall have
the stress screening operation repeated following replacement of
defective components.
3.13 Process control. The contractor shall submit to the
government with the first article sample, process control documents
for the processes listed in the following subparagraphs. These
processes shall be those used in the fabrication of the first article
sample and shall not be changed after approval of the first article
sample. At unscheduled intervals during the operation of the approved
processes, the government inspector shall observe the processes to
ascertain that production to the approved process control documents is
being maintained. No deviation without approval from the procuring
activity shall be allowed. XII the event that the contractor desires a
I
change in an approved process control document, a new first article
sample may, at the discretion of the government be required.
Process control of molded Plastic parts. A process
3.13.1
control document shall be prepared for each of the molded plastic
parts. These documents shall briefly describe the entire process and
shall fully document the controls to be utilized for maintaining the
process. They shall specify the time, temperature, pressure ranges and
cure process which shall be maintained during production of the molded
parts.
3.13.2 Process control of potting. A process control document
shall be prepared for potting the electronic assembly. It shall fully
describe the entire process and the controls for maintaining the
process. It shall specify the preparation of all materials, pot life,
and curing temperature and time.
Material control. The contractor shall prepare and submit
3.14
to the government a material control document. This document shall
detail the procedures used to identify and control the
components/subassemblies to assure that only qualified
components/subassemblies from qualified suppliers are used in the
manufacture or assembly of the Remote Control Unit.
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