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|  MIL-C-64030 (AR)
specified in 4.5.2.3.10.3.
3.5* 3.5 Detonator driver pulses. In response to a HARDWIRE
DEPLOY or RF DEPLOY command, the detonator driver outputs J1-12
(DET1) with respect to J1-24 (DET1(R)) and J1-13 (DET2) with
respect to J1-25 (DET2(R)) , shall meet the requirements of figure
5 when tested as specified in 4.5.2.3.10.4.
3.5.3.6 High voltage supply. With the voltage on Pi-RED
(+14.4VDC) set to 13 + 0.5 volts, the high voltage supply output
voltage at J1-2 (VHV), when enabled, shall be 18.6 volts minimum
and 19.5 volts maximum when tested as specified in 4.5.2.3.10.2.
3.6 Soldering. All soldered electrical connections shall
comply with MIL-S-46844, and MIL-S-45743 and the applicable
drawing.
3.6.1 Solderability. Electronic assembly parts that are to
be soldered shall comply with the solderability requirements of
MIL-S-45743 and MIL-S-46844, except as noted otherwise.
3.7 Stress screening. Before potting, all circuit card
assemblies shall have temperature stress screening performed prior
to bonding and testing. Card assemblies are to be temperature
cycled without power applied. The temperature range is -50
10F to 150 10F with a dwell time at temperature extremes
of 15 5 minutes. The rate of temperature change is 18 degrees
F/minute minimum with 10 cycles minimum. Circuit card assemblies
which have component failures at test representing more than 25%
of the total board components shall have the stress screening
operation repeated following replacement of defective components.
3.8 Inspection data. Data shall be recorded and retained for
all First Article and Quality Conformance tests required by
4.4.2.32 (CI Perf. Char. at all temps.).
3.9 Variable data. The quiescent current, low voltage
detection level and deploy command RF sensitivity shall be
measured and recorded as variable data for the First Article
samples and surveillance tests.
3.10 Surveillance units. The contractor shall provide for
surveillance quantities of electronic assemblies from production.
Units shall be evenly proportioned from production. Inspection
data shall be recorded and retained for all surveillance units.
Requirements, sample frequency and quantities for submission shall
be as specified in the contract.
3.11 First article inspection. This specification contains
provisions for first article inspection. Requirements for the
submission of first article samples by the contractor shall be as
specified in the contract.
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