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Page Title:
Table II. Classification of defects. |
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|  MIL-C-70491(AR)
4.4
Sampling.
4.4.1
Environmental\performance. The display\processor
circuit board assembly shall be inspected to the requirements in
Table II.
TABLE II.
Classification of defects.
Characteristics
Requirement
Test Procedure
No.
100% Inspection
Functional test
4.6.3
1.
3.2.1.1
Memory read cycle
2.
4.6.4
3.2.1.2
3.
4.6.5
RAM write cycle
3.2.1.3
4.6.6
EPROM program cycle
4.
3.2.1.4
4.6.7
EPROM erasure
50
3.2.1.5
4.6.1
ESS temperature
6.
3.3.2
4.6.2
ESS vibration
7.
3.3.3
AOL 1.0% Defective
MAJOR:
Workmanship
4.6.8
3.6
101.
One display/p rocessor circuit board
4.4.2 Special sampling.
assembly shall be selected at "random as a special sample from each
lot or each 100 produced which ever occurs first. The sample shall
meet the requirements and tests in Table III.
Classification of defects.
TABLE III.
Characteristics
Requirement
Test Procedure
No.
Fabrication
Applicable Drawing/
201.
3.4
Visual
Materials
Applicable Drawing/
202.
3.7
Visual
NOTE : The tests in Table III shall be conducted at room ambient
temperature (as specified in 3.3.1).
Should any one item of a special
4.4.3 Failure of sample.
sampling fail to meet the specified test requirements, acceptance
of the represented inspection lot will be suspended by the
Government until necessary corrections have been made by the
contractor and resubmitted items have been approved in accordance
with "Acceptance and Rejection" as specified in MIL-STD-105.
4.5 Inspection equipment. Except as otherwise provided for by
the contract, the contractor shall supply and maintain inspection
equipment in accordance with the applicable requirements of
MIL-I-45607.
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