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MiL-C-70492(AR)
chamber shall be raised 10C (18F) per minute plus or minus
1C (1.8F) to +71F (+160C). The assembly shall remain
at this temperature for a minimum of 20 minutes. Upon completion
of the 20 minute exposure the temperature of the chamber shall be
o
0
reduced 10 C (18 F) per minute plus or minus 1C (1.8F)
to room ambient temperature (as specified in 3.3.1). The above
procedure shall be conducted a minimum of ten times. upon
completion of the cycles the assembly shall then be removed from
the chamber and subjected to the test in 4.6.3. It shall meet the
requirements of 3.2.1.
4.6.2 ESS vibration.  Conduct the vibration test with the
modem circuit card assembly positioned on an appropriate adapter
affixed to a vibrating machine that is capable of providing the
amplitudes and frequencies specified in 3.3.3. Unless otherwuse
specified, the test equipment shall be in accordance with the
"Test Facilities" requirements of Mil-F-13926. The applied motion
shall be in two separate planes for the time period specified.
Upon completion of the vibration sweep the assembly shall be
removed from the vibration adapter and shall be subjected to the
tests in 4.6.3.It shall meet the requirements of 3,2.1.1 and
3.2.1.7 inclusive.
4.6.3  Functional  tests.  This test is to be conducted
utilizing the Computer Automation CA8200 or equivalent.  Use of an
equivalent computer must have prior approval-of the procuring
activity. The display/processor circuit card assembly shall be
attached to the CA8200 utilizing appropriate fixtures and/or
cables and connected as specified in Table IV.  The assembly shall
be tested in accordance with the test patterns contained on the
9379254, provided by the
Software Test Station-Modem CCA:
procuring activity.  The assembly shall meet the requirements of
3.2.1.
Modem circuit card assembly
TABLE IV.
test fixture connector contacts.
CA8200
Connect to
Display/Processor
Pin
Pin
Connector
63
Al
P1
2
A2
P1
3
A3
P1
4
A4
P1
5
A5
P1
6
A6
P1
63
A18
P1
18
A20
P1
160
A21
P1
20
A22
P1
10

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