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Display, Image 11744684
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Printed Circuit Cards



img
MIL-D-48437A(MU) "
at +140F and -4F. Subsequent to such exposure the Display shall not
have been damaged or adversely affected and shall meet electrical per-
formance requirements of this specification at standard room ambient
conditions.
3.3.1.1.2 Humidity.
3.3.1.1.2.1 Operating.- The display shall be capable of meeting
the performance requirements of this specification while exposed to an
atmosphere with a relative humidity (R.H) of 94 4 percent at a temper-
ature of 86F.
3.3.1.1.2.2 Non-operating. - The Display shall be capable Of With-
standing 240 hours of continuous exposure to a relative humidity (RH) of
94 4 percent at temperature cycling of from 73F to 1400F.
3.3.1.1.3 Shock. The Display shall be capable of withstanding
three 10G, 11 milliseconds shock in each of its mutually perpendicular
axis for a total of 18 shocks.
3.3.1.1.4 vibration.- The Display shall be capable of Withstanding
a vibration having a double amplitude of 0.076 in. and acceleration
levels of from 2 to 4G applied logarithmically over the 5 to 500 Hz
frequency range for a 15 minute time duration.
3.3.1.1.5 Salt fog. - The Display shall be capable of withstanding
forty-eight (48) hours of continuous exposure to a 5% salt solution
with a specific gravity of 1.027 to 1.034, a PH of 6.5 to 7.2 and a
temperature of 95F.
3.3.1.1.6 Sand and Dust.- The Display shall be capable of operation
after thirty six hours of exposure to wind driven sand and dust.
3.3.1.1.7 Rain. - The Display shall be capable of operation after
exposure to a 2in/hr, 20Mph wind driven rain. The water temperature shall
be between 60 and 90F.
3.3.1.1.6 Altitude. - The Display shall be capable of operating
during exposure at an altitude of 10,000 ft. after exposure at an altitude
of 50,000 ft.
3.3.1.1.9 Fungus. - The Display shall be capable of withstanding
a twenty-eight (28) day fungus exposure to a composite spore suspension.
3.3.1.1.10 EMI. - The Display shall meet the requirements of MIL-STD-
461A subtest RE02.
3.4 Design and Construction
3.4.1 Composition.- To the maximum extent practical, the equipment
shall consist of solid-state circuitry mounted on printed circuit cards.
3

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