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Page Title:
Quality assurance soldering plan |
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|  MIL-E-63300A(AR)
Electronic assembly.
3.2
3.2.1 Parts. Electronic assembly parts shall comply with the
requirements specified on Drawing 9292965, associated drawings, and
applicable specifications and standards.
3.2.2 Operation. Electronic assembly timing, signal
generation, and low voltage detect operations specified in 3.4.2
shall be in accordance with the requirements on Drawing 9292960.
3.3 Soldering. Soldering procedures and acceptance criteria
for the soldered components shall be in accordance with MIL-S-45743
and MIL-S-46844, except as specified in Appendix herein.
3.3.1 Solderability. Electronic assembly parts that are to be
soldered shall comply with the solderability requirements of
MIL-S-45743 and MIL-S-46844,
3.3.2 Quality assurance soldering plan. The contractor will
generate a Quality Assurance Soldering Plan that will detail the
overall soldering procedure. This plan shall include detailed
information for handling, cleaning, hand soldering, machine
soldering, touch up or rework, process controls: tool maintenance,
flagging procedures for avoiding excessive defects and all other
pertinent QA procedures relative to soldering. The plan shall
include the documentation requirements of MIL-S-46844. This plan
will be generated and submitted to ARRADCOM, DRDAR-QAA-M (see
4.5.19, 6.5).
3.4 Performance characteristics.
3.4.1 Quiescent current. Electronic assembly quiescent current
shall be less than 220 microampers when the supply voltage is 6.5 +
0.10 volts, the ambient temperature 25 5C and the
input/output terminals loaded as specified in 4.5.1.
Timing, signal, and detection operations.
3.4.2
3.4.2.1 Primary Time Base (PTB) oscillator period. The PTB
oscillator period shall comply with 3.2.2 when tested as specified
in 4.5.2.
3.4.2.2 Test Time Base (TTB) oscillator period. The TTB
oscillator period shall comply with 3.2.2 when tested as specified
in 4.5.3.
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