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|  MIL-E-63300A(AR)
confirming that the oscillator check circuit initiates the turn on of
the detonator firing circuit within 32 TTB clock counts after the PTB
oscillator is stopped (See 3.4.4). This is a non-destructive test.
4.5.13 Firing circuit energy. With the electronic assembly under
test connected to the test fixture, verify that the piston actuator,
pressure cartridge, and detonator firing circuits meet the requirements
specified in 3.4.5, 3.4.5.1, 3.4.5.2 and 3.4.5.3. This is a
non-destructive test.
4.5.14 Self-sterilization function, With the electronic assembly
under test connected to the test fixture and the detonator firing
circuit output E30 an open circuit, verify that the voltage of the
firing capacitor is less than 1.3 volts 5 seconds after the firing
circuit is turned on (See 3.4.6). This is a non-destructive test.
4.5.15 Reset circuit. With a linear increasing voltage (zero to
6.5 0.10 d.c. volts in 50 milliseconds rein) applied to VDD of the
electronic assembly from an external d.c. power supply, verify that at
reset the output "PA" at test TP 20 of the initial logic is low and the
output "D" or "F" at TP 17 of the final logic is low. Observation shall
be made for compliance with requirements of 3.4.7. Non-destructive test.
4.5.16 Ambient, hot and cold temperature functional testing. The
sample of electronic assemblies specified in 4,4.3.1 shall be subjected
to all functional tests at the operating temperature extremes. The
units shall be conditioned at the specified temperatures (see 4.4.3.1)
for two hours prior to the test. Testing shall be performed with the
unit in the temperature chamber. Approved functional test equipment
shall be used. Acceptable threshold levels are specified on DWG 9292960
for the temperature extremes. Acceptance limits for the digital
circuitry (SD timing control) at the temperature extremes are specified
on DWG 9292960. Observation shall be made for compliance with 3.5 and
3.6. Non-destructive test.
4.5.17 Printed wiring board cleaning procedures. Printed wiring
board assembly cleaning procedures shall be documented and supplied to
the Government (See 6.5.) Verification of adherence to the cleaning
procedure shall be done on a daily basis (Ref. Data Item DI-T-5372
(tailored)).
4.5.18 Integrated circuit handling procedures. Integrated circuits
require care and handling to avoid damage due to static discharge. The
contractor shall document his handling procedure for the integrated
circuits and supply the procedure to the government (See 6.5.)
Adherence to the handling procedure shall be verified daily. (Ref.
DI-T-5372 (tailored)).
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