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|  MIL-E-63300A(AR)
5.
PREPARATION FOR DELIVERY
5.1 Preservation and packaging
5. 1.1 Level A. The Electronics Assembly shall be preserved and
packaged in accordance with the requirements of MIL-E-17555 as
applicable to printed circuit boards. Each electronic assembly
shall be individually cushioned and secured to prevent any movement
or damage to any of its parts. Folding of the flexible PWC leads is
not permitted.
5.2 Packing.
5.2.1 Level A. The Electronics Assembly, preserved and
packaged as above, shall be packed in accordance with the
requirements of MIL-E-17555 as applicable to printed circuit boards.
5.3 Marking. Marking of the outer box shall comply with the
commerical requirements of MIL-STD-1188. Additional marking
indicating the items to be fragile electronics shall be employed.
5.4 Shipping. When electronic assembly packages or more than
one lot are shipped together, each lot shall be kept separate and
the division between lots clearly indicated to prevent mixing of the
lots in transit.
6.
NOTES
6.1 Intended use. The electronics assembly covered by this
specification is intended for use as a low power timing base and
function generator for use in Mine, Antipersonnel: HE, M74.
6.2 Ordering data.
Procurement documents shall specify the
following:
a.
Title, number, and date of this specification.
b.
Provisions for submission of first article samples.
c.
Provisions of MIL-A-48078.
d.
Certification of conformance.
6.3 Submission of inspection equipment designs for approval.
(See MIL-A-48078) Submit equipment designs as required to:
Commander, U.S Army Armament Research and Development Command,
ATTN: DRDAR-QAA-1, Dover, New Jersey 07801.
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