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|  MIL-I-48331A(AR)
MIL-S-46844
Solder Bath Soldering of
Printed Circuit Assemblies
MIL-P-48189
Housing, Timing & Fuzing (ADAM)
STANDARDS
MILITARY
MIL-STD-105
Sampling Procedures and Tables
for Inspection by Attributes
Test Methods and Procedures
MIL-STD-883
for Microelectronics
MIL-STD-1313
Microelectronic Terms and
Definitions
MIL-STD-1331
Parameters to be Controlled
for the Specification of
Microcircuits
DRAWINGS
us ARMY ARMAMENT RESEARCH AND DEVELOPMENT COMMAND
INTEGRATED CIRCUIT, CONTROL AND TIMING BASE CMOS,
9298507
Tests Vehicle, Ballistic Rail Gun 9298426
Housing, Timing and Fuzing 9298450
3.
REQUIREMNETS
3.1 General. The manufacturer of microcircuits in
compliance with th is specification shall have production and
test facilities and a quality and reliability assurance program
adequate to assure successful compliance with the provisions of
this specification. Only microcircuits which are inspected for
and meet all the requirements specified herein shall be marked
and delivered.
3.2 Terms, definitions and symbols.
For the purpose of
this specification, the terms, definitions and symbols in
MIL-STD-893, MIL-STD-1313, MIL STD-1331, MIL-M-38510 and those
contained herein shall apply.
3.3 Material. Materials shall be in accordance with the
applicable drawings and specifications
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