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|  HIL-L-82452A(OS)
TABLE VII. Shock schedule.
See figure 1 for axes of Logic Assembly.
3.5.3.2 Ready and operating. The Logic Assembly, when operated in an
environment with a temperature between 32F and 98F, shall meet the
performance and product characteristics of this specification (column II
values) after exposure to temperatures between 0F and 140F, for a period
wherein the durations of the upper temperature limit does not exceed 4 hours
at any one time.
3.5.4 Pressure. The Logic Assembly shall withstand external pressures
of from 2.7 to 20.0 pounds per square inch
absolute.
3.5.5 Humidity. The Logic Assembly shall withstand exposure to 95
percent relative humidity at 110F for 8 hours without degradation of finish
or functional capabilities,
3.6 Workmanship. workmanship and finish shall be of sufficiently high
grade to assure satisfactory operation consistent with requirements of this
specification.
All parts used in the logic assembly shall be thoroughly clean
and free of excess materials, chips, and loose or spattered foreign materials.
Standards of workmanship exhibited in any approved first article sample,
subject to any qualifications stated in the Government's notice of approval,
shall be determinative of requirements of the contract relative to workmanship
insofar as not specifically covered by applicable specifications.
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