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Technology Conformance inspection (TCI). |
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|  MIL-M-38510/141B
4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with MIL-PRF-
38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as follows:
a.
Tests shall be as specified in table II herein.
b.
Subgroups 4, 5, 6, 7, 8, 10, and 11 in table I shall be omitted.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as follows:
a.
End point electrical parameters shall be as specified in table II herein.
b.
The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall
be maintained under document control by the device manufacturer's Technology Review Board (TRB) in
accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request.
The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with
the intent specified in test method 1005 of MIL-STD-883.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End point electrical
parameters shall be as specified in table II herein.
4.5 Methods of inspection. Methods of inspection shall be specified and as follows.
4.5.1 Voltage and current. All voltage values given are referenced to the microcircuit ground terminal of the device under test
(DUT). Currents values given for conventional current and are positive when flowing into the referenced terminal.
4.5.2 Life test and burn-in cooldown procedure. When devices are measured at +25C following application of the steady-
state life or burn-in test condition, they shall be cooled within 10C of their power stable condition at room temperature prior to
removal of the bias.
5. PACKAGING
5.1 Packaging requirements. For acquisition purposes, the packaging requirements shall be as specified in the contract or
order (see 6.2). When actual packaging of materiel is to be performed by DoD personnel, these personnel need to contact the
responsible packaging activity to ascertain requisite packaging requirements. Packaging requirements are maintained by the
Inventory Control Point's packaging activity within the Military Department of Defense Agency, or within the Military Department's
System Command. Packaging data retrieval is available from the managing Military Department's or Defense Agency's
automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.
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