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|  MIL-M-38510/203E
1.3 Absolute maximum ratings.
Supply voltage range ..............................................................................
-0.5 V dc to +7.0 V dc
Input voltage range .................................................................................
-1.5 V dc at -10 mA to +5.5 V dc
-65 to +150C
Storage temperature range .....................................................................
+300C
Lead temperature (soldering, 10 seconds) ..............................................
Thermal resistance, junction to case (θJC) 1/ ........................................
See MIL-STD-1835
Output supply voltage .............................................................................
-0.5 C dc to +VCC
Output sink current ..................................................................................
+100 mA
Maximum power dissipation (PD) 2/ .........................................................
739 mW dc
+175C 3/
Maximum junction temperature (TJ).........................................................
1.4 Recommended operating conditions.
Supply voltage (VCC) ............................................................................... +4.5 V dc minimum to
+5.5 V dc maximum
Minimum high-level input voltage (VIH) ................................................... 2.0 V dc
Maximum low-level input voltage (VIL) .................................................... 0.8 V dc
Fanout (each output) ............................................................................ 16 mA 4/
Case operating temperature range (TC)................................................... -55 C to +125 C
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section
does not include documents cited in other sections of this specification or recommended for additional information or as
examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that
they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not
they are listed.
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this specification to the
extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or
contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard for Microelectronics.
MIL-STD-1835
-
Interface Standard Electronic Component Case Outline
______
1/ Heat sinking is recommended to reduce the junction temperature.
2/ Must withstand the added PD due to short circuit test (e.g. IOS).
3/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions
per MIL-PRF-38535.
4/ 12 mA for circuit B.
2
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