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Electrical test requirements.
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Microcircuits, Digital, TTL, Flip-Flops, Monolithic Silicon
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Figure 1. Logic diagram and terminal connections.



img
MIL-M-38510/2G
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as
follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 4, 5, and 6 shall be omitted.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II MIL-PRF-38535.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and
as follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. The steady-state life test duration, test condition, and test temperature, or approved alternatives shall
be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-
in test circuit shall be maintained under document control by the device manufacturer's Technology
Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring
or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and
power dissipation, as applicable, in accordance with the intent specified in test method 1005 of MIL-
STD-883.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End-
point electrical parameters shall be as specified in table II herein.
4.5 Methods of inspection. Methods of inspection shall be specified and as follows:
4.5.1 Voltage and current. All voltages given are referenced to the microcircuit ground terminal. Currents
given are conventional and positive when flowing into the referenced terminal.
6

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