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MIL-M-38510/306E
1.2.3 Case outlines. The case outlines should be as designated in MIL-STD-1835 and as follows:
Descriptive designator
Terminals
Package style
Outline letter
A
GDFP5-F14 or CDFP6-F14
14
Flat pack
B
GDFP4-14
14
Flat pack
C
GDIP1-T14 or CDIP2-T14
14
Dual-in-line
D
GDFP1-F14 or CDFP2-F14
14
Flat pack
E
GDIP1-T16 or CDIP2-T16
16
Dual-in-line
F
GDFP2-F16 or CDFP3-F16
16
Flat pack
X
CQCC2-N20
20
Square leadless chip carrier
2
CQCC1-N20
20
Square leadless chip carrier
1.3 Absolute maximum ratings.
Supply voltage range ............................................................................. -0.5 V dc to 7.0 V dc
Input voltage range ................................................................................ -1.5 V dc at -18 mA to 5.5 V dc
Storage temperature range .................................................................... -65 to +150C
Maximum power dissipation per register, (PD) 1/ :
Device type 01 .................................................................................. 127 mW dc
Device type 02, 03 ............................................................................ 116 mW dc
Device type 04 .................................................................................. 110 mW dc
Device type 05 .................................................................................. 149 mW dc
Device type 06, 07 ............................................................................ 160 mW dc
Device type 08 .................................................................................. 198 mW dc
Device type 09 .................................................................................. 209 mW dc
Lead temperature (soldering, 10 seconds) ............................................. 300C
Thermal resistance, junction to case (θJC):
Cases A, B, C, D, E, F, 2, and X
(See MIL-STD-1835)
Junction temperature (TJ) 2/.................................................................... 175C
1.4 Recommended operating conditions.
Supply voltage (VCC) ..............................................................................
4.5 V dc minimum to 5.5 V dc maximum
Minimum high level input voltage (VIH) ...................................................
2.0 V dc
Maximum low level input voltage (VIL) ....................................................
0.7 V dc
-55 to +125C
Case operating temperature range (TC) .................................................
Minimum clock pulse width:
Device type 01, 03, 05, 07, 09...........................................................
20 ns
Device type 02 ..................................................................................
18 ns
Device type 04, 06, 08.......................................................................
25 ns
Minimum clear pulse width:
Device type 01, 09 ............................................................................
20 ns
Device type 02 ..................................................................................
15 ns
Device type 04 ..................................................................................
30 ns
Device type 05, 07 ............................................................................
25 ns
Minimum load pulse width:
Device type 08 ..................................................................................
30 ns
Minimum setup time at mode control:
Device type 01 .................................................................................
30 ns
Device type 03, 06 ............................................................................
20 ns
_______
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening
conditions in accordance with MIL-PRF-38535.
2

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