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MIL-M-38510/306E
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract
award (see 4.3 and 6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified
herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not
affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein.
3.3.1 Terminal connections and logic diagrams. The terminal connections and logic diagrams shall be as specified on
figure 1.
3.3.2 Truth tables. The truth tables and timing diagrams shall be as specified on figure 2.
3.3.3 Logic diagrams. The logic diagrams shall be as specified on figure 3.
3.3.4 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the
qualifying activity and the preparing activity (DSCC-VAS) upon request.
3.3.5 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I, and apply
over the full recommended case operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups specified in
table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 12
(see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not effect the
form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior to
qualification and quality conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained
under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-
PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test
prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535, appendix B.
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