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MIL-M-38510/314C
1.3 Absolute maximum ratings.
Supply voltage range .............................................................................
-0.5 V dc to 7.0 V dc
Input voltage range ................................................................................
-1.5 V dc at -18 mA to 5.5 V dc
-65 to +150C
Storage temperature range ....................................................................
Maximum power dissipation per flip-flop, (PD) 1/
Device type 01 .................................................................................
110 mW dc
Device type 02 ..................................................................................
149 mW dc
Device type 03 ..................................................................................
61 mW dc
300C
Lead temperature (soldering, 10 seconds) .............................................
Thermal resistance, junction to case (θJC):
Cases A, B, C, D, E, F, and 2 ...............................................................
(See MIL-STD-1835)
175C
Junction temperature (TJ) 2/....................................................................
1.4 Recommended operating conditions.
Supply voltage (VCC) ..............................................................................
4.5 V dc minimum to 5.5 V dc maximum
Minimum high level input voltage (VIH) ...................................................
2.0 V dc
Maximum low level input voltage (VIL) ....................................................
0.7 V dc
-55 to +125C
Case operating temperature range (TC) .................................................
Minimum pulse width ..............................................................................
40 ns
Input pulse rise/fall time, device type 02
Schmitt, B input ................................................................................
1 V/s minimum
1 V/s minimum
Logic, A input ...................................................................................
Clear-inactive-state setup time
Device type 02 .................................................................................
15 ns minimum
External timing resistance, Rext
5 kminimum, 180 kmaximum
Device type 01, 03 ...........................................................................
1.4 kminimum, 70 kmaximum
Device type 02 .................................................................................
External timing capacitance, Cext
Device type 01, 03 ...........................................................................
No restriction
1,000 F maximum
Device type 02 .................................................................................
Output duty cycle, device type 02
RT = 2 k.........................................................................................
50% duty cycle maximum
TT = 70 k........................................................................................
90 % duty cycle maximum
Wiring capacitance, Rext/Cext terminal
Device type 01, 03 (referenced to GND) ..........................................
50 pF maximum
_______
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening
conditions in accordance with MIL-PRF-38535.
2

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