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Design, construction, and physical dimensions. |
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|  MIL-M-38510/314C
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1.1 Specifications and Standards. The following specifications and standards form a part of this specification to the
extent specified herein. Unless otherwise specified, the issues of these documents shall be those listed in the issue of the
Departments of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
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Test Method Standard for Microelectronics.
MIL-STD-1835
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Interface Standard Electronic Component Case Outlines
(Unless otherwise indicated, copies of the above specifications and standards are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein,
the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations
unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract
award (see 4.3 and 6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified
herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not
affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein.
3.3.1 Terminal connections and logic diagrams. The terminal connections and logic diagrams shall be as specified on
figure 1.
3.3.2 Truth table and functional description. The truth table and functional description shall be as specified on figure 2.
3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the
qualifying activity and the preparing activity upon request.
3.3.4 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3
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