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MIL-M-38510/341F
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Descriptive designator
Terminals
Package style
Outline letter
A
GDFP5-F14 or CDFP6-F14
14
Flat pack
B
GDFP4-F14
14
Flat pack
C
GDIP1-T14 or CDIP2-T14
14
Dual-in-line
D
GDFP1-F14 or CDFP2-F14
14
Flat pack
E
GDIP1-T16 or CDIP2-T16
16
Dual-in-line
F
GDFP2-F16 or CDFP3-F16
16
Flat pack
R
GDIP1-T20 or CDIP2-T20
20
Dual-in-line package
S
GDFP2-F20 or CDFP3-F20
20
Flat pack
2
CQCC1-N20
20
Square leadless chip
carrier
Square leadless chip
X
CQCC2-N20
20
carrier
1.3 Absolute maximum ratings.
Supply voltage range .............................................................................
-0.5 V dc to +7.0 V dc
Input voltage range ................................................................................
-1.2 V dc at -18 mA to +7.0 V dc
-65 to +150C
Storage temperature range ....................................................................
Maximum power dissipation, (PD) 1/ :
Device type 01 ..................................................................................
88 mW
Device type 02 ..................................................................................
93.5 mW
Device type 03 ..................................................................................
105 mW
Device type 04 ..................................................................................
187 mW
Device types 05, 06, 10, 11...............................................................
473 mW
Device type 07 ..................................................................................
247 mW
Device type 08 ..................................................................................
247 mW
Device type 09 ..................................................................................
220 mW
+300C
Lead temperature (soldering, 10 seconds)..............................................
Thermal resistance, junction to case (θJC): (See MIL-STD-1835)
175C
Junction temperature (TJ) 2/....................................................................
1.4 Recommended operating conditions. 2/
Supply voltage (VCC) ..............................................................................
4.5 V dc minimum to 5.5 V dc maximum
Minimum high-level input voltage (VIH) ...................................................
2.0 V dc
Maximum low-level input voltage (VIL) ....................................................
0.8 V dc
-55 C to +125 C
Case operating temperature range (TC) ..................................................
Width of clock pulse high:
Device type 01 ..................................................................................
4.0 ns minimum
Device type 02 ..................................................................................
4.0 ns minimum
Device type 03 ..................................................................................
5.0 ns minimum
Device type 04 ..................................................................................
4.0 ns minimum
Device type 05 ..................................................................................
8.0 ns minimum
Device type 06, 07 ............................................................................
7.0 ns minimum
Device type 08 ..................................................................................
4.0 ns minimum
Device type 09 ..................................................................................
4.0 ns minimum
Device types 10, 11...........................................................................
5.0 ns minimum
______
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature should not be exceeded except for allowable short duration burn-in
screening conditions in according with MIL-PRF-38535.
2

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