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MIL-M-38510/348C
1.3 Absolute maximum ratings.
Supply voltage range .............................................................................
-0.5 V to +7.0 V
Input voltage range ................................................................................
-1.2 V dc at -18 mA to +7.0 V dc
-65 to +150C
Storage temperature range ....................................................................
Maximum power dissipation, per device (PD) 1/
Device type 01 .................................................................................
495 mW
Device type 02 .................................................................................
506 mW
Device type 03 and 04 ......................................................................
786.5 mW
+300C
Lead temperature (soldering, 10 seconds) .............................................
Thermal resistance, junction to case (θJC) ..............................................
(See MIL-STD-1835)
175C
Junction temperature (TJ) 2/ ...................................................................
1.4 Recommended operating conditions.
Supply voltage (VCC) ..............................................................................
4.5 V minimum to 5.5 V maximum
Minimum high level input voltage (VIH) ...................................................
2.0 V
Maximum low level input voltage (VIL) ....................................................
0.8 V
Normalized fanout (each output):
Low logic level ..................................................................................
33 maximum
High logic level .................................................................................
50 maximum
-55 to +125C
Case operating temperature range (TC) .................................................
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification.
This section does not include documents cited in other sections of this specification or recommended for
additional information or as examples. While every effort has been made to ensure the completeness of this
list, document users are cautioned that they must meet all specified requirements of documents cited in
sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this specification to
the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard for Microelectronics.
MIL-STD-1835
-
Interface Standard Electronic Component Case Outlines
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-
5094.)
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
_______
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature should not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
2

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