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MIL-M-38510/650B
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535. For product built in accordance with A.3.2.2
of MIL-PRF-38535, or as modified in the manufacturer's QM plan, the "QD" certification mark shall be used in place of
the "Q" or "QML" certification mark.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group
number 36 (see MIL-PRF-38535, appendix A).
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535
or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall
not affect the form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with, MIL-PRF-38535 and shall be conducted on all devices
prior to qualification and quality conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.
b. Delete the sequence specified as initial (pre-burn-in) electrical parameters through interim (post-burn-in)
electrical parameters of method 5004 and substitute lines 1 through 8 of table II herein.
c. Burn-in (method 1015 of MIL-STD-883).
(1)
Unless otherwise specified in the manufacturers QM plan for static tests (test condition A),
ambient temperature (TA) shall be +125C minimum. Test duration for each static test shall be
24 hours minimum for class S devices and in accordance with table I of method 1015 for class
B devices.
i.
For static burn-in I, all inputs shall be connected to GND. Outputs shall be open or
connected to VCC/2. Resistors are optional on outputs if open. Resistors are required on
inputs and outputs connected to VCC/2. R = 470to 47 k.
For static burn-in II, all inputs shall be connected through a resistor to VCC. Output shall
ii.
be open or connected to VCC/2. Resistors are optional on outputs if open. Resistors are
required on inputs and on outputs connected to VCC/2. R = 470to 47 k.
iii. VCC = 6.0 V 0.5 V.
(2)
Unless otherwise specified in the manufacturers QM plan for dynamic test (test condition D),
ambient temperature shall be +125C minimum. Test duration shall be in accordance with
table I of method 1015.
i.
For dynamic burn-in, all inputs shall be connected through the resistors in parallel to a
common CP. Outputs shall connected to VCC/2 0.5 V through the resistors.
R = 1 k0.5% for outputs, 470to 47 kfor inputs.
CP = 25 kHz to 1 MHz square wave; duty cycle = 50 %15%; VIH = 4.5 V to VCC;
ii.
VIL = 0.0 V 0.5 V; transition time 0.5 s.
VCC = 6.0 V 0.5 V.
iii.
4

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