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MIL-M-38510/650B
d.
Interim and final electrical test parameters shall be as specified in table II.
e.
For class S devices, post dynamic burn-in, or class B devices, post static burn-in, electrical parameter
measurements may, at the manufacturer's option, be performed separately or included in the final
electrical parameter requirements.
Percent defective allowable (PDA).
4.2.1
a.
The PDA for class S devices shall be 5 percent for static burn-in and 5 percent for dynamic burn-in,
based on the exact number of devices submitted to each separate burn-in.
b.
Static burn-in I and II failure shall be cumulative for determining the PDA.
c.
The PDA for class B devices shall be in accordance with MIL-PRF-38535 for static burn-in. Dynamic
burn-in is not required.
Those devices whose measured characteristics, after burn-in, exceed the specified delta (Ć) limits or
d.
electrical parameter limits specified in table III, subgroup 1, are defective and shall be removed from the
lot. The verified failures divided by the total number of devices in the lot initially submitted to burn-in shall
be used to determine the percent defective for the lot and the lot shall be accepted or rejected based on
the specified PDA.
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with
MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as
follows:
a. Tests shall be performed in accordance with table II herein.
b. Subgroups 5, 6, 7, and 8 shall be omitted.
c. Subgroup 4 (CIN measurment) shall be measured only for initial qualification and after process or design
changes that may affect input capacitance. Capacitance shall be measured between the designated
terminal and VSS at a frequency of 1 MHz.
d. Subgroups 9 and 11 shall be measured only for initial qualification and after process or design changes
which may affect dynamic performance.
5

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