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|  MIL-M-38510/70C
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Descriptive designator
Terminals
Package style
Outline letter
A
GDFP5-F14 or CDFP6-F14
14
Flat pack
B
GDFP4-F14
14
Flat pack
C
GDIP1-T14 or CDIP2-T14
14
Dual-in-line
D
GDFP1-F14 or CDFP2-F14
14
Flat pack
E
GDIP1-T16 or CDIP2-T16
16
Dual-in-line
F
GDFP2-F16 or CDFP3-F16
16
Flat-pack
X
CQCC2-N20
20
Square chip carrier
2
CQCC1-N20
20
Square chip carrier
1.3 Absolute maximum ratings.
Supply voltage range ......................................................
-0.5 V dc to +7.0 V dc
Input voltage range .........................................................
-1.2 V dc at -18 mA to 5.5 V dc
Storage temperature range ............................................
-65C to +150C
Maximum power dissipation per gate, (PD) 1/
Device types 01 thru 07 ...........................................
49.5 mW
Device type 08 and 09 .............................................
55.0 mW
Device type 10 ........................................................
138.0 mW
Lead temperature (soldering 10 seconds) ......................
300C
Thermal resistance, junction-to-case (θJC) ....................
(See MIL-STD-1835)
175C
Junction temperature (TJ ) 2/ .........................................
1.4 Recommended operating conditions.
Supply voltage (VCC) ......................................................
4.5 V dc minimum to 5.5 V dc maximum
Minimum high level input voltage (VIH) ...........................
2.0 V dc
Maximum low level input voltage (VIL) 3/ .......................
0.8 V dc
-55C to 125C
Case operating temperature range (TC ) .........................
2.0 APPLICABLE DOCUMENT
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification.
This section does not include documents cited in other sections of this specification or recommended for
additional information or as examples. While every effort has been made to ensure the completeness of this
list, document users are cautioned that they must meet all specified requirements of documents cited in
sections 3, 4, or 5 of this specification, whether or not they are listed.
_______
1/ Must withstand the added PD due to short circuit condition (e.g. IOS).
2/ Maximum junction temperature should not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
3/ VIL = 0.7 V dc at +125C.
2
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