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|  MIL-M-38510/753B
g.
Requirements for product assurance and radiation hardness assurance options.
h.
Requirements for special carriers, lead lengths, or lead forming, if applicable. These requirements should not affect
the PIN. Unless otherwise specified, these requirements will not apply to direct purchase by or direct shipment to the
Government.
i.
Requirements for "JAN" marking.
j.
Packaging requirements (see 5.1).
6.3 Superseding information. The requirements of MIL-M-38510 have been superseded to take advantage of the available
Qualified Manufacturer Listing (QML) system provided by MIL-PRF-38535. Previous references to MIL-M-38510 in this
document have been replaced by appropriate references to MIL-PRF-38535. All technical requirements now consist of this
specification and MIL-PRF-38535. The MIL-M-38510 specification sheet number and PIN have been retained to avoid
adversely impacting existing government logistics systems and contractors parts lists.
6.4 Qualification. With respect to products requiring qualification, awards will be made only for products which are, at the
time of award of contract, qualified for inclusion in Qualified Manufacturers List QML-38535 whether or not such products have
actually been so listed by that date. The attention of the contractors is called to these requirements, and manufacturers are
urged to arrange to have the products that they propose to offer to the Federal Government tested for qualification in order that
they may be eligible to be awarded contracts or purchase orders for the products covered by this specification. Information
pertaining to qualification of products may be obtained from DSCC-VQ, 3990 E. Broad Street, Columbus, Ohio 43123-1199.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535, MIL-HDBK-1331, and as follows:
CIN ................................................ Input terminal-to-GND capacitance
GND ............................................ Ground zero voltage potential
ICC................................................. Quiescent supply current
IIL .................................................. Input current low
IIH.................................................. Input current high
TC ................................................ Case temperature
TA ................................................. Ambient temperature
VCC ............................................... Positive supply voltage
CPD ............................................... Power dissipation capacitance
VIC ................................................ Input clamp voltage
VGB ............................................... Ground bounce voltage
O/V ............................................... Latch-up over-voltage
O/I ................................................ Latch-up over-current
tw .................................................. Trigger duration (width)
6.6 Logistic support. Lead materials and finishes (see 3.5) are interchangeable. Unless otherwise specified, microcircuits
acquired for Government logistic support will be acquired to device class S for National Aeronautics and Space Administration or
class B for Department of Defense (see 1.2.2), lead material and finish A (see 3.5). Longer length leads and lead forming
should not affect the part number.
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