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MIL-M-38510/762A
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this
document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue
of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation
(see 6.2).
SPECIFICATION
MILITARY
MIL-M-38510 - Microcircuits, General Specification for.
STANDARD
MILITARY
MIL-STD-883 - Test Methods and Procedures for Microelectronics.
(Unless otherwise indicated, copies of the federal and military specifications, standards, and handbooks are available from the
Standardization Documents Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.)
2.2 Non-Government publications. The following documents form a part of this document to the extent specified herein.
Unless otherwise specified, the issues of the documents which are DoD adopted are those listed in the issue of the DODISS cited
in the solicitation. Unless otherwise specified, the issues of documents not listed in the DODISS are the issues of the documents
cited in the solicitation (see 6.2).
ELECTRONICS INDUSTRIES ASSOCIATION (EIA)
JEDEC Standard No. 17 - A Standardized Test Procedure for the Characterization of LATCH-UP in CMOS Integrated
Circuits.
JEDEC Standard No. 20 - Standard for Description of 54/74ACXXXX and 54/74ACTXXXX Advanced High-Speed
CMOS Devices.
(Applications for copies should be addressed to the Electronics Industries Association, 2001 Eye Street, N.W.,
Washington, DC 20006.)
(Non-Government standards and other publications are normally available from the organizations that prepare or distribute the
documents. These documents may also be available in or through libraries or other informational services.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text
of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-M-38510 and herein.
3.1.1
Terminal connections. The terminal connections shall be as specified on figure 1.
3.1.2
Truth tables. The truth tables shall be as specified on figure 2.
3.1.3  Schematic circuits. The schematic circuits shall be submitted to the preparing activity prior to inclusion of a
manufacturer's device in this specification and shall be submitted to the qualifying activity as a prerequisite for qualification. All
qualified manufacturers' schematics shall be maintained and available upon request.
3

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