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Quality conformance inspection. |
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|  MIL-M-38510/762A
4.2.1 Percent defective allowable (PDA).
a.
The PDA class S devices shall be 5 percent for static burn-in and 5 percent for dynamic burn-in, based on the exact
number of devices submitted to each separate burn-in.
b.
Static burn-in I and II failures shall be cumulative for determining the PDA.
c.
The PDA for class B devices shall be in accordance with MIL-M-38510 for static burn-in. Dynamic burn-in is not
required.
d.
Those devices whose measured characteristics, after burn-in, exceed the specified delta ( ) limits or electrical
parameter limits specified in table I, subgroup 1, are defective and shall be removed from the lot. The verified number
of failed devices times 100 percent, divided by the total number of devices in the lot initially submitted to burn-in shall
be used to determine the percent defective for the lot, and the lot shall be accepted or rejected based on the specified
PDA.
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-M-38510, and 4.3.1 herein. Inspections to
be performed shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.5).
4.3.1 Electrostatic discharge sensitivity qualification inspection . Electrostatic discharge sensitivity (ESDS) testing shall be
performed in accordance with MIL-STD-883, method 3015. Only those device types that pass ESDS testing at 2,000 volts or
greater shall be considered as conforming to the requirements of this specification. ESDS testing shall be measured only for
initial qualification and after process or design changes which may affect ESDS classification.
4.4 Quality conformance inspection. Quality conformance inspection shall be in accordance with MIL-M-38510 and as specified
herein. Inspections to be performed shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D,
and E inspections. (see 4.4.1 through 4.4.5).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table I of method 5005 of MIL-STD-883 and as
follows:
a.
Tests shall be performed in accordance with table II herein.
b.
O/V (latch-up) tests and VGBL/H (ground bounce) tests shall be measured only for initial qualification and after process
or design changes which may affect the performance of the device. Latch-up tests shall be considered destructive.
Test all applicable pins on five devices with zero failures.
CI, CO, and CPD shall be measured only for initial qualification and after process or design changes which may affect
c.
capacitance. Capacitance shall be measured between the designated terminal and GND at a frequency of 1 Mhz.
Test all applicable pins on five devices with zero failures.
d.
Subgroups 9 and 11 tests shall be measured only for initial qualification and after process or design changes which
may affect dynamic performance.
e.
Subgroups 7 and 8 tests shall be sufficient to verify the truth table.
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