2.1.2 Other Government documents, drawings, and publications.
The following other Government documents form a part of this
specification to the extent herein.
U.S. ARMY ARMAMENT RESEARCH, DEVELOPMENT AND ENGINEERING CENTER
Microcircuit, Digital, SCO/DLA Multichip
Microcircuit, Digital, SCO/DLA Test
2.1.2 Other publications.
The following documents form a part
of this specification to the extent specified herein. The issues of
the documents which are indicated as DOD and the supplement thereto,
(Copies of specifications, standards, drawings and publications
required by the suppliers in connection with specific procurement
functions should be obtained from the procuring activity or as
directed by the contracting officer).
2.1.3 Order of precedence.
In the event of a conflict between
the text of this specification and the references cited herein, the
text of this specification shall take precedence.
3.1 Design and Construction. Microcircuit design and
construction shall be in accordance with all the requirements
specified herein and in the detail specification drawing 9333744.
The package dimension shall conform
3.1.1 Physical dimensions.
to drawing 9333744.
3.1.2 Package. The finished component shall be a 22 pin
hermetically sealed package as shown in drawing 9333744. The lead
finish shall be in accordance with MIL-M-38510, Finish A, B, or C.
3.1.3 Lead or terminal material and finish. Lead or terminal
material and finish shall conform to the applicable requirements of
MIL-M-38510 paragraph 3.5.6.
3.1.4 Pin assignment.
The pin assignment shall be in
accordance with figure 1.