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|  MIL-M-63321A(AR)
c.
When the temperature is +25C and
is 7.0 volts, the
period of the output signal at pin 14 shall be 11 2.5
milliseconds.
3.5.5 Dual pins/bond pads. The Q and
lines on the microcircuit
shall each be accessible to external device signals via dual bond pads.
Each bond shall be connected to its own package pin. For the Q line
these pins are 5 and 6, and for the line these pins are 3 and 4. When
tested as specified in 4.5.15, the maximum resistance between pins 5 and
4
6, and between pins 3 and 4 shall be 10 ohms.
3.5.6 Screening. All devices to be delivered in accordance with
this specification shall have been subjected to the screening procedures
as specified in MIL-STD-883, Method 5004 for class B devices, and as
specified herein.
3.5.6.1 Burn-in. The device shall be subject to the burn-in test as
specified in MIL-STD-883, Method 5004 and 4.5.16 herein.
3.5.7 Steady state life. The device shall be subject to the steady
state life test of MIL-STD-883, Method 1005, Condition D and 4.5.17
here in.
3.6 Marking. The device shall be marked with the information
specified, in paragraphs 3.6.1 thru 3.6.5, and the primary markings (index
point, part number, and inspection lot identification code) shall be
located on the top surface of the package. The other markings may be
placed in any suitable location so as to perform their functions and not
interfere with the primary markings.
3.6.1 Index point. See 3.2.
The complete part number shall be as fOllOWS:
3.6.2 Part number.
9292963X
where 9292963 is the Drawing number and X the drawing revision letter, if
applicable.
3.6.3 Inspection lot identification code. The inspection lot
identification code marking shall be in accordance with MIL-M-38510.
6
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