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MIL-M-63530 (AR)
4. 5.2 Defective.  Any device failing to meet the applicable requirements
in the following tests shall be classed and labeled defective and segregated
from the inspection lot.
4.5.3 Test conditions.  Unless otherwise specified all examinations and
tests shall be made under the following conditions.
4.5.4 Leakage current low.  Measure the leakage current into pin 16 after
a power up reset with the inputs connected as shown in Figure 2.  by device
falling to meet the requirements of 3.5.2.1 shall be classed defective.
4.5.5 Leakage current high.  Pause at bit time 2768 of functional test
sequence #7 as shown in Figure 10 and measure the current into pin 16.  The
logic state is defined by the functional test for this measurement Any
device failing to meet the requirements of 3.5.2,2 shall be classed defective.
4.5.6  Input current.  Connect pins 4, 7, 9, 12 and 13 to
and
measure the current into each pin, connect pins 1, 4, 7, 9, 12, 14 and 15 to
(ground) and measure the current out of each pin.  Any device failing to
meet the max current requirement of 3.5.2.3 shall be classed defective.
(Non-destructive test).
4.5.7 Input current.  Measure the current into pin 1, 14 and 15, in turn
with the pin under test held at
Any device failing to meet
requirements of 3.5.2.4 shall be classed defective.  (Non destructive test).
4.5.8 Input current.  Measure the current out of pin 13 with pin 13 held
(ground).  Any device failing to meet the requirements of 3.5.2.5
at
shall be classed defective.
(Non-destructive test).
4.5.9 output low.  Force each of pins 2 and 3 to
through 5K ohms,
then measure the current into pin 2 with pin 2 held at a voltage of 0.1
volts.  Any device failing to meet the requirements of 3.5.2.6 shall be
classed defective.  (Non-destructive test).
4.5.10 Output low.  After a power up reset measure the current into each
pin with each pin held at 1.0 volts.  Any device failing to meet the
requirements of 3.5.2.7 shall be classed defective.  (Non-destructive
test).
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