(2) An I.C. package failure shall be defined as a device
(I.C.) failing to function electrically in which no visible
I.C. Package damage is observed. This criteria should be
interpreted as follows:
(a) An HTF failure attributed to a cracked I.C. in
which an arc face crack has propagated through the I.C.,
shall constitute a NO TEST device but will be recorded and
(b) An HTP failure attributed to a cracked I.C. in
which there is no evidence of arc face cracking, shall be
considered a rejected unit.
(c) An HTF failure attributed to discrete component
(i.e., Capacitor, Thickfilm, etc.) shall be considered an
acceptable unit with regard to the I.C.
(d) An HTF failure with a multitude of problems
(i.e., rejectable Thickfilm Network, etc.) but also a
rejectable I.C. shall be considered a failed unit with
regard to the I.C.
(3) All HTFs fired shall be retrieved and evaluated for
I.C. function. No additional weight shall be placed on any
grouping of test devices (i.e., O defects allowed for high
temp. units). The total defects found out of a total sample
shall be the only criteria considered in determining overall
3.17.3 Qualification of plating process.
At the components level (Preform, S&A Clip, Electronic
Assembly Clip and Sensor Locating Clip).
(1) To qualify the plating process, the Preform, S&A Clip,
Electronics Assembly Clip, Sensor Locating Clip shall be
subjected to the test criteria for Salt Spray as specified in
ASTM B201-80, B117-73. The Type II finish on the preforms and
clips shall be capable of withstanding 96 hours of salt
testing at a temperature of 35°C + 1.1°C (95°F + 2° -
3°F) and shall not exhibit any signs of corrosion. This
test shall be performed prior to the parts being coated with
b. The testing for the plating process shall be done on a
qualification basis only. The qualification sample size shall
be 10 parts each (10 preform assemblies and clip assemblies).
The parts, after being submitted to salt spray testing, shall
not exhibit any form of rust. The sampling plan shall be 10-0-1.