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|  MIL-T-48409A(MU)
3.3.2.3 Vibration. - Module to be mounted as used. Test per MIL-STD-
810, Method 514.2, Procedure VIII, Curve V, Figure 514.2-6, resonance dwell
not required. Module shall meet the requirements of 3.3.3 subsequent to
the test.
3.3.2.4 Shock. - Test per MIL-STD-810, Method 516.2, Procedure I,
Module shall meet require-
Figure 516.2-1, Note 1
ments of 3.3.3 subsequent to this test.
3.3.25. Humidity. - Test per MIL-STD-810, Method 507.1, Produce IV,
Figure 507.1-3. Chamber temperature not to exceed 155F. Module to meet
requirements of 3.3.3 subsequent to this test.
3.3.2.6 Fungus. - Test per MIL-STD-810, Method 508.1, Procedure I.
Module to meet requirement of 3.3.3 subsequent to this test.
3.3.3 Performance-operation. - When the following voltages are
applied simultaneously, the output waveform at TP-3 shall conform to
Figure 1. Voltages: 24 6 VDC applied to Pin "M" (TP-1), 135 10 VDC
applied to Pin "K" and 14 1 VDC applied to Pin "A" through a 1K, 1/4
watt resistor.
OUTPUT WAVEFORM TP-3
FIGURE 1
I
3
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