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|  MIL-C-48610B(AR)
4.6.3.3 High temperature. Subject the assembly to the high temperature
test specified in MIL-STD-810 method 501.1, procedure I. The highest
operating temperature shall be 140F. The performance tests of table V
shall be applied.
4.6.3.4 Low temperature. Subject the assembly to the low temperature
test specified in MIL-STD-810, method 502.1, procedure I. The storage
temperature shall be -65F. The lowest operating temperature shall be
-25F. The performance tests of table V shall be applied.
4.6.3.5 Temperature cycling. With power and loads of table I applied,
subject the assembly to the temperature profile specified in figure 5. At the
conclusion of this test, subject the assembly to the performance tests of
table V.
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