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MIL-C-50740(MU)
8 August 1973
3.
REQUIREMENTS
3.1 Fabrication. The circuit card assembly, herein referred to
as the assembly, shall be manufactured in accordance with Drawing
F11738808 and drawings pertaining thereto.
3.2 General specification. The assembly shall meet the
following requirements, where applicable, of MlL-F-l 3926:
a. Order of precedence
b. Dimensions and tolerances
c. Part identification and marking
d. Electrical and electronic assemblies
e. Workmanship.
3.2.1 Soldering. Soldering shall be in accordance with MIL-S-45743
or MIL-S-46844, except that bare copper wire exposure shall be permitted
at clipped ends of component leads.
3.3 Performance. Unless otherwise specified, the assembly
shall meet the performance requirements of this specification at standard
ambient texnpe ratures between 60 degrees Fahrenheit (F) and 90F.
3.3.1 Loads, poser, signals, and interconnections. The assembly
shall perform as specified herein when the loads, power, signals, and
interconnections of table I are applied as specified.
3.3.1.1 Battery power switching. With the power sources
(item 2) of table I applied, and with an input voltage of +24.0 2.0 Vdc applied
to P1-15, the voltage at Pi-5 shall be +24.O 3.0 Vdc. With the input
voltage at P1-15 decreased to +16.5 O.5 Vdc, the voltage at Pi-5 shall
be +0.4 O.4 Vdc.
3.3.1.2 Malfunction (MALF) light disable. With the power
source and input voltage of +24.O 2.O Vdc applied as in 3.3.1.1,
the output voltage at Pi-8 shall be +5.0 0.3 Vdc. With P1-22 and P1-7
disconnected, the output voltage at P1-8 shall be +0.2 0.2 Vdc. With
the voltage at P1-15 disconnected, the output voltage at Pi-8 shall be
+5.0 0.3 Vdc.
3

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