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| MIL-C-70498(AR)
4.3
Inspection
provisions.
4.3.1 Submission of product. unless otherwise specified by
the contracting officer, inspection lot size, lot formation, and
presentation of lots shall be in accordance with "Submission of
product" provision of MIL-STD-105.
4..3.2 Examination and tests.
4.3.2.1 Components and subassemblies, all components and
subassemblies shall be inspected in accordance with the inspection
provisions contained in Quality Assurance Provisions (QAP'S
listed in the Technical Data Package (TDP). In the absence of
QAP's, the applicable Quality Assurance Provisions of MIL-F-13926
shall apply.
4..4 Sampling.
4.4.1 Environmental\performance. The interconnect
shall
be
inspected to the requirements in Table III.
Classification of defects.
TABLE III.
Test procedure
Requirement
Characteristics
No.
100% Inspection
4.6.3
3.2
Functional test
1.
4.6.1
3.3.2
ESS temperature
2.
4.6.2
3.3.3
ESS Vibration
3.
AQL 1.0% Defective
MAJOR:
4.6.4
3.6
Workmanship
101.
4.4.2 Special sampling. one interconnect shall be selected
at random as a special sample from each lot or each 100 produced
which ever occurs first. The sample shall meet the requirements
and tests in Table IV.
Classification of defects.
TABLE IV.
Test procedure
Requirement
Characteristics
No.
Applicable Drawing/
3.4
Fabrication
201.
Visual
Applicable Drawing/
3.7
Materials
202.
Visual
NOTE: The tests in Table III shall be conducted at room ambient
temperature (as specified in 3.3.1).
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