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Materials, parts, and processes. |
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|  MIL-D-85859(AS)
3.2 First article. When specified in the contract or purchase order, a
sample shall be subjected to first article inspection (see 4.4 and 6.3).
3.3 Materials, parts, and processes. Materials, parts, and processes used
in the distribution box shall be as specified in MIL-T-28800, MIL-STD-454
and 3.3.1 through 3.3.2.2.
3.3.1 Parts.
All parts shall be selected from Government furnished
baseline or those parts included in ANA Bulletin No. 400, unless the parts
listed therein will not perform as required in the intended applications and
environments specified herein. If the latter is the case, request for use
of nonstandard parts shall be obtained by the contractor in accordance with
MIL-STD-965. Procedure I.
3.3.1.1 Solid state design. All microelectronic devices shall be selected
as specified in Requirement 64 of MIL-STD-454 and MIL-STD-883. Hybrid
microcircuits, including radio frequency, memory, microwave, and multimeter
types are considered microelectronic devices and shall be controlled by
Requirement 64 of MIL-STD-454. Hybrid and complex monolithic microcircuits
are considered critical items and shall be treated as specified in
MIL-STD-785. Any deviation from all solid state construction shall be
authorized by the procuring activity prior to initiation.
3.3.1.2 Microcircuits and semiconductors. All microcircuits and
semiconductors shall be packaged in hermetic packages. No plastic
encapsulated devices shall be used.
3.3.1.2.1 Microcircuit devices. Only microcircuits listed in MIL-STD-1562
and procured as specified in MIL-M-38510 are standard for new design. When
nonstandard microcircuit devices are approved for use as specified-in the
general requirement of MIL-M-38510, Class B shall apply. Nonstandard
devices shall be screened and qualified as specified in MIL-STD-883 (Test
Methods 5004.3 and 5005.3). The qualification as specified in the
requirements of Methods 5005.3, Group C, shall be satisfied by submission of
approved test results for all standard and nonstandard microcircuit devices.
3.3.1.2.2 Semiconductor devices. Only JANTX semiconductor devices selected
as specified in MIL-STD-701 are standard. When a JANTX device is not
listed, the selection of nonstandard devices shall conform to the following
order of precedences:
a.
A JAN device listed as specified in MIL-STD-701.
b.
A JAN device covered as specified by MIL-S-19500 but not listed in
MIL-STD-701.
A commercial device.
c.
The description of JANTX, JAN, and TX shall be specified by MIL-S-19500.
As a minimum, a TX burn-in requirement as specified in Requirement 30 of
MIL-STD-454 shall be required for all nonstandard devices. All
semiconductors shall be selected as specified in Requirement 30 of
MIL-STD-454. Only solid glass metallurgically bonded axial lead diodes and
rectifiers shall be used. When TO-5 and TO-18 packages are required, they
shall be limited to the solid metal header type. All semiconductor device
junctions shall be protected and no organic or desiccant materials shall be
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