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MIL-E-48630(AR)
(Application for copies should be addressed to:  American
Society for Testing and Materials, 1916 Race Street, Philadelphia,
PA., 19102).
Technical society and technical association specifications and
standards are generally available for reference from libraries.
They are also distributed among technical groups and using Federal
agencies.
2.1.3 Order of precedence.  In the event of a conflict between
the text of this specification and the references cited herein, the
text of this specification shall take precedence.
3.
REQUIREMENTS
Materials shall be in accordance with the
3.1 Materials.
applicable drawings and specifications.
3.2 Components and assemblies.  The components and assemblies
shall comply with all requirements specified on drawing
9342551-1,-2, and 9342552-1,-2, and 9342576, and associated drawings
and with all requirements specified in applicable specifications and
standards.
3.3 Physical characteristics.
3.3.1 Envelope and dimensions.  The envelope and dimensions of
the electronic assembly shall conform to the requirements on
drawings 9342551 or 9342552 as applicable.
3.3.2 Potting.  Potting material shall comply with the
requirements of drawing 9287115 and 9287148 and shall be
manufactured and dispensed in accordance with the processes,
procedures and controls delineated therein.  The potted electronic
assembly shall not show evidence of voids and/or bubbles or
workmanship defects exceeding the following criteria:
a)  Bubbles that are less than 1/4 inch in the maximum physical
dimension are permissible.  The total volume occupied by bubbles or
voids cannot exceed 1/8 cu. in. (1/2 X 1/2 X 1/2" cube). In
addition, no bubbles shall be in contact with any electronic
component except that the power supply is allowed to trap bubbles
under the lip of the battery on the contact end.
(A bubble is
defined to be entrapped air with no exposure to the surface.)
b)
Single or multiple voids less than 1/4 inch in the maximum
physical dimension are permissible on the surface except as defined
in c and d.  The total volume occupied by bubbles or voids cannot
exceed 1/8 cu. in.  (1/2 X 1/2 X 1/2" cube) and must not expose any
components or the printed circuit board.
(A void is defined as an
irregularity of any shape which is open to the surface.)
c)  Voids on the outer circumference of the lens are permissible
provided no component or part of the printed wiring board is exposed.
4

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