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| MIL-E-63300A(AR)
APPENDIX
50 PRINTED WIRING BOARD ASSEMBLIES
Following wave soldering, printed wiring board assemblies
shall be inspected (under adequate lighting and magnification) for
soldering workmanship.
50.1 Major Defect Inspection
a. Inspection shall be to a 0.40 percent AQL, MIL-STD-105,
Level II, normal sampling plan.
b.
A board will be defined as defective during inspection if:
1. The bottom contains any joints defined as unacceptable
by any of the documentation in sections 20, 30 and 40 of this
appendix.
2. The top contains any joint defined as unacceptable by
the documentation listed in 1 above except twelve (12) joints are
allowed to be dewetted, A dewetted joint on the top must have
evidence of solder in the hole when viewed from the top.
3. A maximum of thirty- five (35) joints with O to 20%
voids will be allowed on each board; and no more than twenty (20)
joints with 0-20% voids will be allowed on any one side of the
printed wiring board.
50.2 Minor Defect Inspection
a. Inspection shall be on the sample size as specified in
paragraph 50.1 above.
b. A board will be defined as defective if it contains three
(3) or more minor defects.
c. Accept/reject criteria for the lot shall be to a 4.0%
AQL, MIL-STD-105, Level II, normal sampling plan.
d.
Minor defects are defined as the following:
1. Conductive surfaces closer than .010" but greater than
.005" assembly characteristics only, not relative to the printed
wire board construction.
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