Electronics-MCD Assembly for Mine, Anti-Tank: Blu 91/B

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Electronics-MCD Assembly for Mine, Anti-Tank: Blu 91/B

Electronics-MCD Assembly for Mine, Anti-Tank: Blu 91/B
Specifications and Standards
Other Government Documents, Drawings, and Publications
Potted Electronic Assembly
Electronic Assemblies Performance Characteristics
Primary Time Base Oscillator (PTB) Check
Detonator Firing Circuit
Process Control of Molded Plastic Parts
Electrical Workmanship
Test Mine Assemblies
Figure 1. Function Test Mode
Requalification
Classification of Defects and Tests:Electronic-MCD Assemblies
Classification of Defects and Tests:Electronic-MCD Assemblies -Cont.
Classification of Defects and Tests:Electronic-MCD Assemblies -Cont.
Quality Conformance Inspection
Classification of Defects and Tests:Resistor, Fixed Composition
Classification of Defects and Tests:Resistor, Fixed Film
Classification of Defects and Tests:Resistor, Fixed Film -Cont.
Classification of Defects and Tests:Transistor, (P/N 9287122-1, JANTXV 2N2907)
Classification of Defects and Tests:Semi-Conductor Device, Diode, Type JANTX IN645-1
Classification of Defects and Tests:Diode, Zener,JANTX IN 4463 and JANTX IN4471
Classification of Defects and Tests:Diode, Hot Carrier (JAN INS711 MIL-S-19500/127)
Classification of Defects and Tests:Capacitor, Fixed, Plastic Dielectric (.22 uF)
Classification of Defects and Tests:Capacitor, Fixed Electrolytic Tantalum, Solid (82 uF)
Classification of Defects and Tests:Capacitor, Fixed, Electrolytic Tantalum, Solid
Classification of Defects and Tests:Capacitor, Ceramic, Fixed Dielectric Molded, Axial
Classification of Defects and Tests:Capacitor, Ceramic, Fixed Dielectric-Axial Lead
Classification of Defects and Tests: Eyelet
Classification of Defects and Tests:Terminal, Stud
Classification of Defects and Tests: Support Foam
Classification of Defects and Tests:Board, Printed Wiring
Classification of Defects and Tests: Fuse, Electric
Classification of Defects and Tests:Microcircuit, Digital, CMOS
Classification of Defects and Tests:Core, Toroid
Classification of Defects and Tests:Magnetometer Assembly
Classification of Defects and Tests:Shorting Bar,Ceramic
Classification of Defects and Tests:Shorting Bar and Connector Assembly
Classification of Defects and Tests:Standoff,EBP
Classification of Defects and Tests:Receiver Coil Assembly
Classification of Defects and Tests: MCD Assembly
Classification of Defects and Tests:Board, Printed Wiring
Classification of Defects and Tests: Coil
Classification of Defects and Tests:Bushing, Power Supply
Classification of Defects and Tests:Lid, Electronics Assembly
Classification of Defects and Tests:Housing, Electronics Assembly
ELectronics-MCD Assembly
Classification of Defects and Tests:Printed Wiring Board Assembly
Classification of Defects and Tests:Electronic Assembly (Performance Characteristics) (Ambient)
Classification of Defects and Tests:Electronic Assembly (Performance Characteristics) (Ambient) -Cont.
Classification of Defects and Tests:Electronic Assembly
Classification of Defects and Tests:Electronic Assembly -Cont.
Classification of Defects and Tests:Electronic Assembly (Performance Characteristics) (145 Degree + 5 Degree F)
Classification of Defects and Tests:Electronic Assembly (Performance Characteristics) (145 Degree + 5 Degree F) -Cont.
Classification of Defects and Tests:Electronic Assembly (Mechanical)
Classification of Defects and Tests:Electronics-MCD Asssembly
Classification of Defects and Tests:Electronics-MCD Asssembly
Quality Conformance Inspection
Launcher Simulator
Dimensional Control of Molded or Plastic Parts
Potted Electronic Assembly
Sensor Mode Functioning
Disposition of duds
Quiscent Current Test
Low Voltage Detect Test
Target Sensor Functioning Test
Verification of Safe Condition of S and A Assembly
Packaging
Data Requirements
Non Hazardous Dud
Test Mine Assemblies
Appendix: Supplemental Soldering Provisions
Supplemental Solder Workmanship Standards
Component Alignment
Shorting Bar Soldering
Solder Build-up
Terminal Edge Coincident with Pad Edge
Terminal Overlap Pad
Bridging Between Terminals
Magnetometer Soldering
Acceptable Protrusion of Wire
Evidence of Solder Paste in Solder Connection
Evidence of Contamination in Solder Connection
Supplemental Quality Assurance Provisions
Minor Defect Inspection
Standardization Document Improvement Proposal

Electronics-MCD Assembly for Mine, Anti-Tank: Blu 91/B

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