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|  MIL-I-48331A(AR)
3.4 Physical dimensions. The integrated circuit shall
compIy with all the requiremen ts specified in Drawing No.
9298507, all associated drawings, and with the requirements
specified in MIL-STD-883, Method 2016.
The I.C. leads shall comply with the
3.5 Soldrability.
solderability requirements of MIL-STD-883, Method 2003.
3.6 Resistance to solvents. The I.C. marking shall not
become illegible when subjected to solvents and comply with the
resistance to solvents requirements of MIL-STD-883, Method 2015.
3.7 Bond strength. Wires from the circuit die to the
component wire bonds shall be capable of meeting the bond
strength requirements of MIL-STD-883, Method 2011., Condition
D. Pull all bonds on five (5) devices. There small be no
failures less than one (1) gram.
3.8 Die bond shear strength. The integrated circuit shall
comply with the die band shear strength requirements of
MIL-STD-883, Method 2019.
3.9 Pre-cap visual. The integrated circuit (IC) shall
comply with the pre-cap requirements of MIL-STD-883, Method
2010.2 - test condition B except delete paragraphs 3.2.1.7,
3.2.2, 3.2.6, 3.2.7, 3.2.8 and 3.2.9.
3.10 Lead fatigue. The IC package shall comply with the
lead fatigue requirements of MIL-STD-883, Method 2004, Test
condition B2. (Piece part level)
3.11 Seal fine and gross. The IC shall meet the
requirements of MIL-STD-833 method 1014 conditions A or B and C.
3.12 Conditioning screen. The integrated circuit shall be
conditioned through the screening procedures listed in
paragraph 4.4.2.2 and in accordance with the applicable test
methods of MIL-STD-883.
3.13 Dynamic burn-in test. The IC shall be burned-in at a
temperature of one hundred and twenty five degrees centigrade
plus or minus five degrees centigrade (125C + 5C) for a
minimum time of forty eight (48) hours with the IC connected as
shown in figure 18.
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