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|  4.5.28 Post shock testing. After the test vehicle has
been subjected to the mechanical shock environments, wedges
will be inspected for mechanical damage. The microcircuit will
be tested in accordance with the Electrical Tests in
MIL-P-48189(AR). Any failure attributable to the microcircuit
is cause for rejection.
4.5.29 Process controls. The Government shall monitor the
vendor's facility for compliance with MIL-M-38510. In
addition, at random intervals, the Government Inspector shall
monitor the contractor's quality and acceptability of
metallization on the semiconductor dice using the scanning
electron microscope. As a minimum, the following shall be
monitored.
a.
Metallization at all oxide steps.
General Metallization, defects such as peeling
b.
and voiding.
4.5.30 Data requirements. The contractor shall submit a
quality inspection test, demonstration and evaluation report
detail in accordance with Data Item Description DI-R-1724
(tailored\. A certificate of compliance shall be submitted to
the technical agency listed in 6.5.
PREPARATION FOR DELIVERY
5.
5.1
Preservation and packaging.
5.1.1 Level C. The Integrated Circuit shall be preserved
and packaged in accordance with MIL-M-55565.
Marking of the carton shall comply with
5.2 Marking.
MIL-STD-1169.
5.3 Shipping. When integrated circuit packages of more
than one lot are shipped together, each lot shall be kept
separate and the division between lots clearly indicated to
prevent mixing of the lots in transit.
6.
NOTE
6.1 Intented use. The integrated circuit covered by this
specification is intended for use on as a low power timing base
and function generator for use in scatterable mine assemblies.
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