2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This section
does not include documents cited in other sections of this specification or recommended for additional information or as
examples. While every effort has been made to ensure the completeness of this list, document users are cautioned that
they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this specification, whether or not they
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications and standards form a part of this
specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
- Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
- Test Method Standard for Microelectronics.
- Interface Standard Electronic Component Case Outlines.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited herein,
the text of this document shall take precedence. Nothing in this document, however, supersedes applicable laws and
regulations unless a specific exemption has been obtained.
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract
award (see 4.3 and 6.3).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified
herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall
not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein.
3.3.1 Block diagram and terminal connections. The block diagrams and terminal connections shall be as specified on
figures 5 through 8.
3.3.2 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the
qualifying activity and the preparing activity (DSCC-VA) upon request.
3.3.3 Case outlines. The case outlines shall be as specified in 1.2.3 and on figures 1, 2, 3, and 4.