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MIL-M-38510/140A
4.3 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.3.1 Qualification extension. For qualification inspection, if a manufacturer qualifies to device type 01 (monolithic)
or device type 03 (hybrid), which is designed and manufactured identically (same die or dice, same process, same
screening) in all respects (except electrical testing) to device type 02 (monolithic) or device type 04 (hybrid)
respectively, then qualification may be extended to device type 02 or 04 respectively when authorized by the
qualifying activity. Additionally, qualification may be extended to device type 02 or 04 respectively only after
acceptance by the qualifying activity of subgroup C1 testing performed on the AT device types (see 6.6) and
submission of data in accordance with MIL-PRF-38535.
4.4 Technology Conformance inspection (TCI). Technology conformance inspection shall be in accordance with
MIL-PRF-38535 and herein for groups A, B, C, and D inspections (see 4.4.1 through 4.4.4).
4.4.1 Group A inspection. Group A inspection shall be in accordance with table III of MIL-PRF-38535 and as
follows:
a.
Tests shall be as specified in table II herein.
b.
Subgroups 10 and 11 shall be omitted.
Subgroup 8 (LE (All codes test) 55C TA +125C, class B only ) shall be performed only for initial
c.
qualification and after process or design changes which may affect the Integral Linearity error.
The sample size series number for subgroup 8 shall be 5.
4.4.2 Group B inspection. Group B inspection shall be in accordance with table II of MIL-PRF-38535 and as
follows:
a.
End point electrical parameters shall be as specified in table II herein. Delta limits shall apply only to
group C inspection for class B devices.
4.4.3 Group C inspection. Group C inspection shall be in accordance with table IV of MIL-PRF-38535 and as
follows:
a.
End point electrical parameters shall be as specified in table II herein.
b.
The steady-state life test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit
shall be maintained under document control by the device manufacturer's Technology Review Board (TRB)
in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon
request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in
accordance with the intent specified in test method 1005 of MIL-STD-883.
4.4.4 Group D inspection. Group D inspection shall be in accordance with table V of MIL-PRF-38535. End point
electrical parameters shall be as specified in table II herein.
4.5 Methods of inspection. Methods of inspection shall be as specified and as follows.
4.5.1 Voltage and current. All voltage values given are referenced to the microcircuit ground terminal. Currents
given are conventional and positive when flowing into the referenced terminal.
4.5.2 Life test and burn-in cooldown procedure. When devices are measured at +25C following application of
steady state life or burn-in test condition, they shall be cooled within +10C of their power stable condition at room
temperature prior to removal of the bias.
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