3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before
contract award (see 4.3 and 6.3).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the
QM plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be
as specified in MIL-PRF-38535 and herein.
3.3.1 Logic diagram and terminal connections. The logic diagram and terminal connections shall be as specified
on figure 1.
3.3.2 Truth tables and logic equations. The truth tables and logic equations shall be as specified on figure 2.
3.3.3 Schematic circuit. The schematic circuit shall be maintained by the manufacturer and made available to the
qualifying activity and the preparing activity upon request.
3.3.4 Case outlines. Case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. Lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table 1
and apply over the full recommended case operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group
number 1 (see MIL-PRF-38535, appendix A).
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535
or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall
not effect the form, fit, or function as described herein.
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-38535.
4.3 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior
to qualification and conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as
specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test
circuit shall be maintained under document control by the device manufacturer's Technology Review
Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or
preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power
dissipation, as applicable, in accordance with the intent specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical
parameters test prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535.