Microcircuits, Digital, CMOS, 65, 536-BIT Static Random Access Memory (SRAM), Monolithic Silicon

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Microcircuits, Digital, CMOS, 65, 536-BIT Static Random Access Memory (SRAM), Monolithic Silicon

Microcircuits, Digital, CMOS, 65, 536-BIT Static Random Access Memory (SRAM), Monolithic Silicon
Design, construction, and physical dimensions
Figure 1. Case outlines
Figure 2. Terminal connections
Figure 2. Terminal connections Device types 05 and 06
Figure 3. Block diagam
Figure 3. Block diagam Device type 05
Figure 3. Block diagam Device type 06
Figure 4. Truth table
Die overcoat
Table 1. Electrical performance characteristics (device types 01 through 04)
Table 1. Electrical performance characteristics (device types 01 through 04)-cont.
Table 1. Electrical performance characteristics (device types 01 through 04)-cont.
Table 1. Electrical performance characteristics (device types 05 through 06)
Table 1. Electrical performance characteristics (device types 05 through 06)-cont.
Table 1. Electrical performance characteristics (device types 05 through 06)-cont.
Figure 5. Burn-in and steady-state life test circuit
Figure 5. Burn-in and steady-state life test circuit Device types 05 and 06
Figure 5. Burn-in and steady-state life test circuit Device types 05 and 06-cont.
Figure 6B. Read cycle waveforms (device type 05)
Figure 7A. Write cycle waveforms (device types 01-04)
Figure 7C. Write cycle waveforms (device type 05)
Figure 7D. Write cycle waveforms (device type 06)
Figure 7B. Write cycle waveforms (device types 01-04)
Qualification extension
Table 2. Electrical test requirements
Table 3. Group A inspection for device types 01 and 02
Table 3. Group A inspection for device types 01 and 02-cont.
Table 3. Group A inspection for device types 01 and 02-cont.
Table 3. Group A inspection for device types 01 and 02-cont.
Table 3. Group A inspection for device types 03 and 04
Table 3. Group A inspection for device types 03 and 04-cont.
Table 3. Group A inspection for device types 03 and 04-cont.
Table 3. Group A inspection for device types 03 and 04-cont.
Table 3. Group A inspection for device types 05 and 06
Table 3. Group A inspection for device types 05 and 06-cont.
Table 3. Group A inspection for device types 05 and 06-cont.
Table 3. Group A inspection for device types 05 and 06-cont.
Figure 9. Output load circuit
Life test, burn-in, and voltage stress cooldown procedures
Application and operation guidelines
Abbreviations, symbols, and definitions
Timing parameter abbreviations
Logistic support
Appendix. Functional Algorithms
Data retention, data background - checkerboard
Custodians

Microcircuits, Digital, CMOS, 65, 536-BIT Static Random Access Memory (SRAM), Monolithic Silicon

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