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MIL-M-38510/327B
1.3 Absolute maximum ratings.
Supply voltage range .............................................................................
-0.5 V to 7.0 V
Input voltage range ................................................................................
-1.5 V dc at -18 mA to 5.5 V dc
-65 to +150C
Storage temperature range ....................................................................
Maximum power dissipation (PD) 1/ .......................................................
143 mW dc
300C
Lead temperature (soldering, 10 seconds) .............................................
Thermal resistance, junction to case (θJC):
Cases A, B, C, D, E, F, and 2 ...............................................................
(See MIL-STD-1835)
+175C
Junction temperature (TJ) 2/...................................................................
1.4 Recommended operating conditions.
Supply voltage (VCC) ..............................................................................
4.5 V minimum to 5.5 V maximum
Minimum high level input voltage (VIH) ...................................................
2.0 V
Maximum low level input voltage (VIL) ....................................................
0.7 V
-55C to +125C
Case operating temperature range (TC) .................................................
Normalized fanout (each output) ............................................................
10 maximum
Width of input count pulse, tP(IN):
Input A, clock ....................................................................................
20 ns minimum
Input B ..............................................................................................
25 ns minimum
Width of clear pulse ................................................................................
20 ns minimum
Input clock frequency (FMAX):
Input A (Types 01, 02, 03) ................................................................
0 to 25 MHz
Input B (Type 01) .............................................................................
0 to 12.5 MHz
Setup time (Types 01 and 02)
Clear inactive state setup time
(time for clear to A or B input ) .................................................
35 ns minimum
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1.1 Specifications and Standards. The following specifications and standards form a part of this specification to the
extent specified herein. Unless otherwise specified, the issues of these documents shall be those listed in the issue of
the Departments of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883
-
Test Method Standard for Microelectronics.
MIL-STD-1835
-
Interface Standard Electronic Component Case Outlines
(Unless otherwise indicated, copies of the above specifications and standards are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
_______
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening
conditions in accordance with MIL-PRF-38535.
2

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