3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract
award (see 4.3 and 6.4).
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as
specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM
plan shall not affect the form, fit, or function as described herein.
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
specified in MIL-PRF-38535 and herein.
3.3.1 Terminal connections and logic diagrams. The terminal connections and logic diagrams shall be as specified on
figures 1 and 2.
3.3.2 Truth tables. The truth tables and logic equations shall be as specified on figure 3.
3.3.3 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the
qualifying activity and the preparing activity (DSCC-VAS) upon request.
3.3.4 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I, and
apply over the full recommended case operating temperature range, unless otherwise specified.
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups
specified in table II. The electrical tests for each subgroup are described in table III.
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 10
(see MIL-PRF-38535, appendix A).
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not effect
the form, fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior to
qualification and quality conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in
the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be
maintained under document control by the device manufacturer's Technology Review Board (TRB) in
accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon
request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in
accordance with the intent specified in test method 1015 of MIL-STD-883.
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters
test prior to burn-in is optional at the discretion of the manufacturer.
c. Additional screening for space level product shall be as specified in MIL-PRF-38535, appendix B.