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Page Title:
Recommended operating conditions. |
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|  MIL-M-38510/350A
1.3 Absolute maximum ratings.
Supply voltage range .............................................................................
-0.5 V dc to +7.0 V dc
Input voltage range ................................................................................
-1.2 V dc at -18 mA to +7.0 V dc
-65 to +150C
Storage temperature range ....................................................................
Maximum power dissipation, per device (PD) 1/
Device type 01 .................................................................................
209 mW
Device type 02 .................................................................................
187 mW
+300C
Lead temperature (soldering, 10 seconds) .............................................
Thermal resistance, junction to case (θJC) ..............................................
(See MIL-STD-1835)
175C
Junction temperature (TJ) 2/ ...................................................................
1.4 Recommended operating conditions.
Supply voltage (VCC) .............................................................................. 4.5 V dc minimum to 5.5 V dc
maximum
Minimum high level input voltage (VIH) ................................................... 2.0 V dc
Maximum low level input voltage (VIL) .................................................... 0.8 V dc
Normalized fanout (each output) 3/ :
Low level .......................................................................................... 33 maximum
High level ......................................................................................... 50 maximum
Case operating temperature range (TC) ................................................. -55 to +125C
Width of clock pulse high:
Device type 01, 02 ........................................................................... 4.0 ns minimum
Width of clock pulse low:
Device type 01, 02 ........................................................................... 7.0 ns minimum
Setup time in high to clock pulse:
Device type 01, 02 ........................................................................... 4.5 ns minimum
Setup time in low to clock pulse:
Device type 01, 02 ........................................................................... 4.5 ns minimum
Setup time S high to clock pulse:
Device type 01 ................................................................................. 10.5 ns minimum
Device type 02 ................................................................................. 9.5 ns minimum
Setup time S low to clock pulse:
Device type 01 ................................................................................. 10.5 ns minimum
Device type 02 ................................................................................. 9.5 ns minimum
Hold time in high to clock pulse:
Device type 01, 02 ........................................................................... 1.5 ns minimum
Hold time in low to clock pulse:
Device type 01, 02 ........................................................................... 1.5 ns minimum
Hold time S high to clock pulse:
Device type 01, 02 ........................................................................... 0 ns minimum
Hold time S low to clock pulse:
Device type 01, 02 ........................................................................... 0 ns minimum
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification.
This section does not include documents cited in other sections of this specification or recommended for
additional information or as examples. While every effort has been made to ensure the completeness of this
list, document users are cautioned that they must meet all specified requirements of documents cited in
sections 3, 4, or 5 of this specification, whether or not they are listed.
_______
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature should not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
3/ The device should fanout in both high and low levels to specified number of inputs of the same device
type as that being tested.
2
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