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|  MIL-M-38510/371B
1.2.3 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows:
Descriptive designator
Terminals
Package style
Outline letter
A
GDFP5-F14 or CDFP6-F14
14
Flat pack
B
GDFP4-F14
14
Flat pack
C
GDIP1-T14 or CDIP2-T14
14
Dual-in-line
D
GDFP1-F14 or CDFP2-F14
14
Flat pack
E
GDIP1-T16 or CDIP2-T16
16
Dual-in-line
F
GDFP2-F16 or CDFP3-F16
16
Flat pack
K
GDFP2-F24 or CDFP3-F24
24
Flat pack
L
GDIP3-T24 or CDIP4-T24
24
dual-in-line package
R
GDIP1-T20 or CDIP2-T20
20
dual-in-line package
S
GDFP2-F20 or CDFP3-F20
20
Flat pack
2
CQCC1-N20
20
Square leadless chip
carrier
3
CQCC1-N28
28
Square leadless chip
carrier
1.3 Absolute maximum ratings.
Supply voltage range ............................................................................. -0.5 V dc to +7.0 V dc
Input voltage range ................................................................................ -1.5 V dc at -18 mA to +7.0 V dc
Storage temperature range .................................................................... -65 to +150C
Maximum power dissipation, (PD) 1/ :
Device type 01 and 02.......................................................................
11 mW
Device type 03 ..................................................................................
13 mW
Device type 04 and 05.......................................................................
19 mW
Device type 06 and 07.......................................................................
22 mW
300C
Lead temperature (soldering, 10 seconds)..............................................
Thermal resistance, junction to case (θJC):
Cases A, B, C, D, E, F, K, L, R, S, 2, and 3 (See MIL-STD-1835)
175C
Junction temperature (TJ) 3/..............................................................
1.4 Recommended operating conditions.
Supply voltage (VCC) ..............................................................................
4.5 V dc minimum to 5.5 V dc maximum
Minimum high-level input voltage (VIH) ...................................................
2.0 V dc
Maximum low-level input voltage (VIL) ....................................................
0.8 V dc
-55 C to +125 C
Case operating temperature range (TC) ..................................................
Width of clock pulse high (tp CLOCK):
Device type 01, 02, 04, 05, 06, and 07..............................................
16.5 ns
Device type 03 ..................................................................................
20 ns
Width of CLEAR pulse (tp CLEAR ):
Device types 01, 02, and 03.............................................................. 15 ns
Device type 06 .................................................................................. 10 ns
Width of PRESET pulse (tp PRESET ):
Device types 01, 02, and 03.............................................................. 15 ns
Device type 07 .................................................................................. 10 ns
______
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature should not be exceeded except for allowable short duration burn-in
screening conditions in according with MIL-PRF-38535.
2
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