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Recommended operating conditions. |
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|  MIL-M-38510/60B
1.3 Absolute maximum ratings.
Supply voltage range ............................................................................. 0 V dc to -7.0 V dc
Input voltage range
0 V dc to 5.2 V dc
Storage temperature range .................................................................... -65 to +150C
Maximum power dissipation, (PD) 1/ ...................................................... 55 mW
Lead temperature (soldering, 10 seconds) ............................................. +260C
Junction temperature (TJ) 2/ ................................................................... 165C
Maximum output current ........................................................................ -50 mA
Thermal resistance, junction to case (θJC):
Cases E, F, and 2 ............................................................................... (See MIL-STD-1835)
1.4 Recommended operating conditions.
Supply voltage (VEE) ......................................................................
-5.46 V minimum to 4.94 V maximum
-1.105 V at TC = 25C
Minimum high level input voltage ...................................................
-1.000 V at TC = 125C
(at 500 linear feet per minute) (ft/min) ........................................
-1.255 V at TC = -55C
.................................................................................................
-1.475 V at TC = 25C
Maximum low level input voltage ...................................................
-1.400 V at TC = 125C
(at 500 linear ft/min) ...................................................................
-1.510 V at TC = -55C
.................................................................................................
Normalized fanout (each output) ..................................................10
3/
Operating temperature range (TC).................................................. -55 to +125C
(at 500 linear ft/min)
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification.
This section does not include documents cited in other sections of this specification or recommended for
additional information or as examples. While every effort has been made to ensure the completeness of
this list, document users are cautioned that they must meet all specified requirements of documents cited in
sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and Standards. The following specifications and standards form a part of this
specification to the extent specified herein. Unless otherwise specified, the issues of these documents are those
cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
_______
1/ Must withstand the added PD due to short-circuit test (e.g., IOS).
2/ Maximum junction temperature should not be exceeded except in accordance with allowable short
duration burn-in screening condition in accordance with MIL-PRF-38535.
3/ Device will fanout in both high and low levels to the specified number of data inputs on the same device
type as that being tested.
2
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