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|  MIL-M-38510/757C
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
4.1.1 Burn-in and life test circuits. Burn-in and life test circuits shall be constructed so that the devices are stressed at the
maximum operating conditions stated in 4.2c or 4.2d, as applicable, or equivalent as approved by the qualifying activity.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior to
qualification and quality conformance inspection. The following additional criteria shall apply:
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained
under document control by the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015 of MIL-STD-883.
b. Delete the sequence specified as initial (pre-burn-in) electrical parameters through interim (post-burn-in) electrical
parameters of method 5004 and substitute lines 1 through 7 of table II herein.
c. Static burn-in (test condition A) method 1015 of MIL-STD-883. Test duration for each static test shall be 24 hours
minimum for class S devices and in accordance with table I of method 1015 for class B devices.
(1) For static burn-in I, all inputs shall be connected to GND. Outputs may be open or connected to
VCC/2. Resistors R1 are optional on both inputs and open outputs, and required on outputs connected to
VCC/2 0.5 V. R1 = 220Ω to 47 kΩ.
(2) For static burn-in II, all inputs shall be connected through the R1 resistors to VCC. Outputs may be open or
connected to VCC/2 0.5 V. Resistors R1 are optional on open outputs, and required on outputs connected
to VCC/2 0.5 V. R1 = 220Ω to 47 kΩ.
(3) VCC = 5.5 V +0.5 V, -0.00 V.
d.
Dynamic burn-in, test condition D method 1015 of MIL-STD-883.
(1) Input resistors = 220Ω to 2 kΩ 20 percent.
(2) Output resistors = 220Ω 20 percent.
(3) VCC = 5.5 V +0.5 V, -0.00 V.
(4) The output enable control pins shall be connected through the resistors in parallel to VCC or GND, as
applicable, to enable the outputs. All other inputs shall be connected through the resistors in parallel to a
clock pulse (CP). Outputs shall be connected through the resistors to VCC/2.
(5) CP = 25 kHz to 1 MHz square wave; duty cycle = 50 percent 15 percent; VIH = 4.5 V to VCC,
VIL = 0 V 0.5 V; tr, tf ≤ 100 ns.
e.
Interim and final electrical test parameters shall be as specified in table II.
f.
For class S devices, post dynamic burn-in, or class B devices, post static burn-in, electrical parameter
measurements may, at the manufacturer's option, be performed separately or included in the final electrical
parameter requirements.
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