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|  MIL-M-38510/79D
1.3 Absolute maximum ratings.
Supply voltage range ...................................................... -0.5 V dc to +7.0 V dc
Input voltage range ......................................................... -1.2 V dc at -18 mA to +5.5 V dc
Storage temperature range ............................................ -65C to +150C
Maximum power dissipation (PD) 1/ :
Device types 01 and 02 .............................................. 385 mW
Device type 03............................................................ 430 mW
Device type 04............................................................ 336 mW
Device type 05............................................................ 468 mW
Device type 06............................................................ 545 mW
Device type 07............................................................ 479 mW
Device type 08............................................................ 550 mW
Lead temperature (soldering 10 seconds) ...................... 300C
Thermal resistance, junction-to-case ( θ JC) :
Cases E, F, 2, and X .......................................... (See MIL-STD-1835)
Junction temperature (TJ ) 2/ .......................................... +175C
1.4 Recommended operating conditions.
Supply voltage (VCC)........................................................
4.5 V dc minimum to 5.5 V dc maximum
Minimum high level input voltage (VIH) ...........................
2.0 V dc
Maximum low level input voltage (VIL) ............................
0.8 V dc 3/
Case operating temperature range (TC ) .........................
-55C to 125C
2.0 APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification.
This section does not include documents cited in other sections of this specification or recommended for
additional information or as examples. While every effort has been made to ensure the completeness of this
list, document users are cautioned that they must meet all specified requirements of documents cited in
sections 3, 4, or 5 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications and standards. The following specifications and standards form a part of this specification to
the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38535 -
Integrated Circuits (Microcircuits) Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883
-
Test Method Standard for Microelectronics.
MIL-STD-1835
-
Interface Standard Electronic Component Case Outlines
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-
5094.)
2.3 Order of precedence. In the event of a conflict between the text of this specification and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
_______
1/ Must withstand the added PD due to short circuit condition (e.g., IOS) test.
2/ Maximum junction temperature should not be exceeded except in accordance with allowable short
duration burn-in screening conditions in accordance with MIL-PRF-38535.
o
3/ VIL = 0.7 V at +125 C
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